- on wafer chip test
- 薄片内芯片检测
English-Chinese electron industry dictionary (英汉电子工程大词典). 2013.
on wafer chip test
Look at other dictionaries:
on-wafer chip testing — plokštelės lustų tikrinimas statusas T sritis radioelektronika atitikmenys: angl. on wafer chip testing vok. Chiptesten auf dem Wafer, n; On Wafer Chiptesten, n rus. проверка кристаллов ИС на пластине, f pranc. test des puces in situ, m … Radioelektronikos terminų žodynas
Wafer testing — is a step performed during semiconductor device fabrication. During this step, performed before a wafer is sent to die preparation, all individual integrated circuits that are present on the wafer are tested for functional defects by applying… … Wikipedia
test des puces in situ — plokštelės lustų tikrinimas statusas T sritis radioelektronika atitikmenys: angl. on wafer chip testing vok. Chiptesten auf dem Wafer, n; On Wafer Chiptesten, n rus. проверка кристаллов ИС на пластине, f pranc. test des puces in situ, m … Radioelektronikos terminų žodynas
Wafer-scale integration — Wafer scale integration, WSI for short, is a yet unused system of building very large integrated circuit networks that use an entire silicon wafer to produce a single super chip . Through a combination of large size and reduced packaging, WSI… … Wikipedia
Wafer dicing — is the process by which individual silicon chips or integrated circuits on a silicon wafer are separated following the processing of the wafer. The dicing process can be accomplished by scribing and breaking, by mechanical sawing (normally with a … Wikipedia
Test microélectronique — Cet article concerne le test de composants microélectroniques. Plusieurs points seront developpés: Pourquoi tester les composants Lien entre le design et le test Différents test appliqués aux composants Sommaire 1 Raison du test de composants 1.1 … Wikipédia en Français
Wafer (electronics) — Polished 12 and 6 silicon wafers. The flat cut into the right wafer indicates its doping and crystallographic orientation (see below) … Wikipedia
Wafer prober — A wafer prober is a machine used to test integrated circuits. OverviewIntegrated circuits are fabricated in large numbers by a complex series of printing steps on silicon wafers. This process permits integrated circuits to be produced cheaply but … Wikipedia
wafer drop-in test chip group — puslaidininkinės plokštelės tikrinamų lustų grupė statusas T sritis radioelektronika atitikmenys: angl. wafer drop in test chip group vok. eingefügte Testchipgruppe, f rus. группа тестовых кристаллов ИС в полупроводниковой пластине, f pranc. jeu… … Radioelektronikos terminų žodynas
Design For Test — (aka Design for Testability or DFT ) is a name for design techniques that add certain testability features to a microelectronic hardware product design. The premise of the added features is that they make it easier to develop and apply… … Wikipedia
Chiptesten auf dem Wafer — plokštelės lustų tikrinimas statusas T sritis radioelektronika atitikmenys: angl. on wafer chip testing vok. Chiptesten auf dem Wafer, n; On Wafer Chiptesten, n rus. проверка кристаллов ИС на пластине, f pranc. test des puces in situ, m … Radioelektronikos terminų žodynas
